JPH0241432U - - Google Patents

Info

Publication number
JPH0241432U
JPH0241432U JP1988119669U JP11966988U JPH0241432U JP H0241432 U JPH0241432 U JP H0241432U JP 1988119669 U JP1988119669 U JP 1988119669U JP 11966988 U JP11966988 U JP 11966988U JP H0241432 U JPH0241432 U JP H0241432U
Authority
JP
Japan
Prior art keywords
pair
piezoelectric elements
bonding device
wire bonding
clamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988119669U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988119669U priority Critical patent/JPH0241432U/ja
Publication of JPH0241432U publication Critical patent/JPH0241432U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP1988119669U 1988-09-12 1988-09-12 Pending JPH0241432U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988119669U JPH0241432U (en]) 1988-09-12 1988-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988119669U JPH0241432U (en]) 1988-09-12 1988-09-12

Publications (1)

Publication Number Publication Date
JPH0241432U true JPH0241432U (en]) 1990-03-22

Family

ID=31365100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988119669U Pending JPH0241432U (en]) 1988-09-12 1988-09-12

Country Status (1)

Country Link
JP (1) JPH0241432U (en])

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